SK Hynix Stock: The $14 Billion U.S. Listing Could Land in August

TLDR

• SK Hynix is targeting a U.S. listing via American depositary receipts (ADRs) as early as August 2026
• The SEC is expected to approve the ADR listing application during the week of June 22
• The offering could raise up to $14 billion, based on earlier reports
• SK Hynix’s stock has jumped 240% this year and its market cap has surpassed $1 trillion
• The listing would join a pipeline of high-profile IPOs including OpenAI, Anthropic, and SpaceX

SK Hynix is moving closer to a U.S. stock market debut, with sources telling Reuters the South Korean chipmaker is targeting a listing as early as August 2026.

The company filed a confidential application with the SEC back in March. According to two sources familiar with the matter, the SEC is expected to approve SK Hynix’s ADR listing application during the week of June 22.

When the confidential filing was first reported in March, sources indicated the offering could raise as much as $14 billion.

A Year to Remember

SK Hynix stock (000660.KS) has surged 240% so far this year. Its market cap crossed $1 trillion in May, making it only the third Asian company — after TSMC and Samsung — to hit that milestone.

The company is the world’s second-largest memory chipmaker and a major supplier of high-bandwidth memory (HBM) chips to Nvidia. Those chips are in heavy demand for AI servers, which has driven much of the stock’s run.

Reuters reported last week that SK Hynix had received “tremendously positive” feedback from investors on its U.S. listing plans, citing strong AI demand and its position in the HBM market.

A Busy IPO Pipeline

An August listing would add SK Hynix to what is shaping up to be a packed second half for U.S. equity markets.

Investors are already watching a queue of AI-linked listings, including OpenAI, Anthropic, and SpaceX’s anticipated blockbuster IPO.

SK Hynix competes in the memory chip space with Samsung (SSNLF) and Micron (MU). A U.S. listing would give American investors more direct access to the HBM market, which sits at the core of the current AI infrastructure buildout.

The SEC was not immediately available for comment on the application timeline.

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